 |
|
The Evaluation of Solder Joints Reliability
for Electronic Products
-Industrial Research Institute of Ishikawa (50th Report)-
|
| Yasuto YONEZAWA, Yoshiteru DOUGUCHI, Akira HEYA and Toshiharu
MINAMIKAWA |
In the field of electronics, products are required to have highly reliable
performance, including impact-resistance, in spite of the trend to downsizing.
Moreover, solder will have to be replaced with lead-free material in the
near future. In order to help companies in Ishikawa Prefecture cope with
these problems, a jig for evaluating mechanical properties of solder joints
was introduced and its effectiveness was confirmed. In addition, a database
of past failure analysis was prepared in order to improve the efficiency
of failure analysis in the future. It will improve manufacturer reliability,
and is expected to facilitate prompt failure analysis in the future. Some
examples of failure analysis are presented in this report.
|
|
| ■ |
Keywords ■■■ |
| |
failure analysis, reliability, solder
joint |
 |
|
PDFファイルをご覧になるためには、アクロバットリーダーが必要です。
ダウンロードはこちら |
|
